Kurtz Ersa expands into advanced semiconductor packaging
Kurtz Ersa has integrated ATV Technologie GmbH to form Kurtz Ersa Semicon GmbH, combining reflow and vacuum thermal technologies to support high-precision semiconductor and advanced packaging manufacturing.
Kurtz Ersa Inc. has expanded its presence in microelectronics and semiconductor technology with the integration of ATV Technologie GmbH, now operating as Kurtz Ersa Semicon GmbH.
The move combines Kurtz Ersa’s reflow soldering expertise with ATV’s vacuum and speciality thermal processing technologies to support advanced packaging and power electronics manufacturing.
At the heart of the expanded portfolio is the SRO i-Line reflow platform, engineered for high-precision semiconductor and substrate processing with controlled heating, optimised cooling, and vacuum-assisted soldering.
Complementing this are VADU batch vacuum systems that minimise voiding in solder joints, critical for automotive, industrial, and wide-bandgap semiconductor applications.
The combined technologies allow a coordinated workflow from R&D and pilot production to scalable manufacturing while maintaining strict thermal control and process repeatability.
Ernie Grice, Vice President of Sales at Kurtz Ersa, emphasised that the integration provides advanced thermal solutions tailored for semiconductor and microelectronics production.
This strategic expansion positions Kurtz Ersa to meet the growing reliability and precision demands of advanced semiconductor packaging worldwide.
