Grand Process Technology & Taiwan Tech team up on advanced packaging
Grand Process Technology and National Taiwan University of Science and Technology have launched a five-year partnership to develop AI-driven semiconductor advanced packaging technologies while strengthening equipment innovation and industry talent development.
Grand Process Technology has signed a five-year cooperation agreement with National Taiwan University of Science and Technology to establish an advanced semiconductor packaging platform focused on equipment innovation, materials development, and talent training.
The Hsinchu-based semiconductor equipment and chemical materials supplier said the collaboration will support next-generation packaging technologies driven by growing demand for artificial intelligence (AI) and high-performance computing. The partners plan to invest NT$50 million (US$1.6 million) in joint research and development.
Grand Process Technology provides equipment and materials used in advanced packaging processes such as chip-on-wafer-on-substrate (CoWoS), with customers including Taiwan Semiconductor Manufacturing Company and Advanced Semiconductor Engineering.
Under the agreement, the university and industry partner will collaborate on advanced electroplating and X-ray inspection technologies aimed at improving process stability, materials reliability, and manufacturing yields.
The initiative will also include scholarships and hands-on industry training opportunities to strengthen Taiwan’s semiconductor talent pipeline.
Grand Process Technology Chair Chang Hung-tai said increasing AI computing requirements are accelerating the shift from single-step packaging processes toward integrated system-level solutions, driving demand for more precise equipment and optimised material design.
The university added that joint R&D outcomes are expected to generate new patents, combining Grand Process Technology’s existing portfolio of 149 patents with academic research strengths in semiconductor manufacturing, silicon photonics, integrated circuit design, and advanced materials.
Grand Process Technology reported revenue of NT$6.51 billion last year, marking nearly 60% year-on-year growth, supported by rising advanced packaging demand and order visibility extending into the first half of 2026.
