KLA boosted by advanced packaging demand
KLA’s advanced packaging business surged 70% in 2025, fueled by AI and HPC chip demand, with growth set to continue in 2026.
KLA Corporation is benefiting from robust growth in advanced packaging as semiconductor packages become increasingly complex for AI and high-performance computing (HPC) applications.
In 2025, KLA generated $950 million in total systems revenue, up 70% year-over-year, primarily driven by advanced packaging process control products and market share gains.
The company expects momentum to continue in 2026, with revenue growth projected in the mid-to-high teens, fueled by investments in heterogeneous integration and next-generation chip packaging technologies.
The advanced packaging segment, currently valued at $11 billion, is growing faster than KLA’s core wafer fabrication equipment (WFE) business. As chipmakers expand capacity for AI, HPC, and high-bandwidth memory applications, demand for KLA’s process control solutions is rising.
“KLA’s advanced packaging leadership positions us to capture increasing value as semiconductor packages become more complex,” said company executives. “Our differentiated technology portfolio is aligned with market trends toward AI, HPC, and heterogeneous integration.”
While competition from companies such as ASML and Applied Materials remains strong, KLA’s focus on process control for advanced packaging is expected to continue driving growth in the high-performance chip ecosystem.
