ACM Research wins multiple equipment orders
ACM Research lands global orders for wafer- and panel-level advanced packaging systems.
ACM Research, a leading provider of wafer and panel processing solutions for semiconductor and advanced packaging applications, has received multiple orders from global semiconductor and technology customers.
The orders include wafer-level advanced packaging systems for a Singapore-based OSAT, panel-level vacuum cleaning equipment for a semiconductor packaging manufacturer outside mainland China, and additional wafer-level systems for a North America-based technology company. Deliveries are scheduled across the first quarter and later this year.
The company’s equipment spans coating, developing, wet etching, stripping, cleaning, and electroplating solutions, supporting critical advanced packaging workflows.
The panel-level order features ACM’s Ultra C vac-p system, a patent-pending vacuum-enhanced cleaning tool designed for fan-out panel-level packaging (FOPLP) and fine-pitch interconnects, with support for multiple panel sizes up to 600 × 600 mm.
“These global orders reinforce our leadership in wafer-level advanced packaging equipment while demonstrating our technology’s extension into panel-level applications,” said Dr David Wang, CEO of ACM. “We remain committed to innovation to meet customers’ increasingly demanding process and yield requirements.”
As advanced packaging adoption grows in AI, high-performance computing, and data centre markets, ACM’s portfolio highlights scalable, high-performance manufacturing solutions for both 2.5D and 3D integration.
