Kaynes Semicon adopts synopsys simulation for advanced packaging
Kaynes Semicon has announced the strategic adoption of advanced engineering simulation software from Synopsys to strengthen manufacturing quality, reliability, and time-to-market across its semiconductor packaging operations.
The implementation integrates Synopsys’ multiphysics simulation tools into Kaynes Semicon’s R&D and production workflows at its Sanand facility, enabling simulation-driven package development from concept through qualification.
The deployment is being delivered through the Ansys channel partner ecosystem in collaboration with Infinipoint Technologies.
As semiconductor packaging complexity increases, simulation-led engineering is becoming critical for optimising performance and reliability in advanced packaging architectures.
The adoption supports design and analysis across thermal management, electronics reliability, and multiphysics modelling for chips, 3D-ICs, and heterogeneous integration platforms.
According to the company, embedding simulation early in the development lifecycle will improve yield efficiency, reduce development timelines, and accelerate deployment of scalable packaging solutions targeting applications including AI, high-performance computing, automotive, and power electronics.
The initiative also enables optimisation of complex OSAT workflows such as FC-QFN and System-in-Package (SiP) technologies, while supporting emerging multi-chip module and photonics integration requirements.
The move aligns with India’s broader efforts to expand domestic semiconductor manufacturing under national initiatives aimed at building globally competitive assembly and test capabilities.
By integrating advanced simulation into manufacturing processes, Kaynes Semicon aims to strengthen reliability-driven OSAT production and support the country’s growing role in the global semiconductor supply chain.
