Saras expands packaging team
Saras Micro Devices has appointed former Amkor executives to accelerate commercialization of its embedded power delivery technology for AI and high-performance computing applications.
Saras Micro Devices has expanded its senior leadership team as it moves toward commercial scaling of its advanced packaging technology for next-generation AI and high-performance computing systems.
The company has appointed Shaun Bowers as senior vice president of product management and Georgette Woodyard as senior vice president of sales and business development.
Both executives bring extensive semiconductor packaging experience from their previous roles at Amkor Technology, supporting Saras’ efforts to advance customer adoption and market expansion.
Bowers brings more than 25 years of semiconductor industry experience spanning advanced packaging, manufacturing, product development, and technology integration.
At Saras, he will focus on aligning product strategy, customer requirements, manufacturing considerations, and technology development.
Woodyard brings more than 35 years of semiconductor packaging and OSAT experience, with expertise in global sales, customer engagement, and business development.
She will lead Saras’ commercial strategy and support partnerships as the company expands its market presence.
The leadership changes come as Saras scales its STILE™ technology, an integrated packaging approach designed to improve power delivery for high-performance semiconductor devices.
The technology embeds passive components within the package substrate, bringing energy storage and regulation closer to processors and accelerators.
By reducing power delivery network impedance and improving voltage regulation, Saras aims to address growing power challenges in AI infrastructure and high-performance computing systems, where advanced packages must support increasingly power-dense processors.
The company said it has established more than 15 customer engagements, particularly in AI infrastructure, and has built an intellectual property portfolio including more than 60 patent filings and more than a dozen granted U.S. patents.
As AI workloads continue to drive demand for higher-performance semiconductor systems, package-level power delivery is becoming a critical focus area for advanced packaging innovation.
Saras’ technology targets this challenge by integrating power management directly into advanced package architectures.
