Nvidia fuels US packaging expansion
A new multi-year agreement will expand advanced packaging and test capacity in Arizona to support growing demand for AI infrastructure.
NVIDIA and Amkor Technology have signed a multi-year agreement worth $1.5 billion to expand advanced semiconductor packaging and test capacity in the United States, strengthening domestic manufacturing for AI and accelerated computing platforms.
Under the agreement, Nvidia will make a prepayment to support the expansion of Amkor’s advanced packaging operations, including capacity at its Arizona facilities.
The companies will also jointly develop advanced packaging and testing technologies designed to integrate multiple chip types within a single package, supporting next-generation AI systems.
Amkor, which already provides advanced packaging services for Nvidia’s data centre processors, said the expanded partnership will help accelerate the introduction of new packaging technologies as demand for AI infrastructure continues to grow.
The agreement follows Amkor’s recently announced 10-year partnership with TSMC to strengthen advanced packaging capabilities in the US.
The company is also working with Advanced Micro Devices on packaging technologies for its processors, highlighting the increasing importance of advanced packaging in enabling high-performance AI devices.
