Report examines future packaging materials
A new IDTechEx report highlights the critical role of materials, hybrid bonding, and thermal management in enabling the next generation of advanced semiconductor packaging.
A new report from IDTechEx explores the materials and manufacturing technologies expected to shape advanced semiconductor packaging over the next decade, as demand for AI and high-performance computing (HPC) drives increasingly complex package architectures.
The report, Materials and Processing for Advanced Semiconductor Packaging 2027–2037: Technologies, Players, Forecasts, examines the material choices and process innovations required to improve manufacturing yield across 2.5D and 3D packaging technologies.
Among the key areas covered are silicon, organic, and glass interposers used in 2.5D packaging.
While silicon remains the preferred option for high-performance applications due to its fine routing capabilities, the report notes that organic interposers and glass core substrates are gaining attention as potential alternatives for larger AI and HPC packages because of their scalability and cost advantages.
The study also examines the growing adoption of Cu-Cu hybrid bonding for 3D integration, comparing wafer-to-wafer (W2W) and die-to-wafer (D2W) approaches.
Although D2W bonding offers greater flexibility for heterogeneous integration and chiplet-based designs, it also introduces stricter requirements for alignment accuracy, contamination control, and manufacturing precision.
Thermal management is identified as another key challenge, particularly as higher package power densities and stacked architectures create localized hotspots.
The report highlights growing interest in next-generation thermal interface materials, including metal- and graphene-based solutions, to improve heat dissipation and long-term reliability.
According to IDTechEx, advances in materials, process control, and manufacturing techniques will be essential to supporting future generations of AI, HPC, and chiplet-based semiconductor devices as advanced packaging continues to evolve.
