SEMI updates assembly database
The 2026 edition of SEMI's Worldwide Assembly & Test Facility Database expands coverage to more than 820 facilities and adds new insights into advanced packaging, AI, photonics and compound semiconductor capabilities.
SEMI and TechSearch International have released the 2026 edition of the Worldwide Assembly & Test Facility Database, expanding coverage of the global semiconductor back-end manufacturing landscape and adding new data on advanced packaging, compound semiconductors, AI and photonics.
The updated database tracks more than 820 assembly and test facilities operated by integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) providers, up from 750 facilities in the 2025 edition.
According to SEMI, the expansion provides greater visibility into facility capabilities, manufacturing technologies and end markets.
Among the new additions are facility-level classifications for advanced packaging, substrate and interposer platforms, including silicon interposers, redistribution layers (RDL), laminate and ceramic substrates, as well as expanded information on assembly, test and module capabilities.
The database also identifies more than 360 facilities with compound semiconductor capabilities covering silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP).
More than 170 facilities support AI and high-performance computing (HPC) applications, while over 70 facilities focus on photonics and optical markets.
"AI infrastructure, photonics and compound semiconductors are expanding the range of capabilities required across semiconductor assembly and test," said Clark Tseng, senior director of Market Intelligence at SEMI. "The 2026 database gives users a more detailed view of which facilities support these technologies and end markets."
In addition to expanded facility profiles, the 2026 edition includes updated OSAT revenue and capital expenditure rankings, helping users benchmark the industry's leading outsourced assembly and test providers.
The database is intended to help semiconductor manufacturers, equipment and materials suppliers, investors and analysts evaluate global manufacturing footprints, identify potential partners and monitor changes in the semiconductor back-end supply chain.
