NSW invests in advanced packaging
A new semiconductor advanced packaging facility in Bradfield City will support domestic manufacturing, photonics, quantum technologies and microelectronics as part of New South Wales' investment in advanced industry.
The New South Wales (NSW) Government has announced the construction of a new 7,000 m² facility in Bradfield City that will house Australia's first commercial Semiconductor Advanced Packaging Facility, marking a significant investment in the country's semiconductor manufacturing capabilities.
The facility, known as the Second Building, forms part of the state's Advanced Manufacturing Readiness Facility (AMRF) programme and is intended to provide Australian companies with access to advanced semiconductor packaging, microelectronics and precision manufacturing services.
According to the NSW Government, the facility will feature ISO Class 5 cleanroom laboratories, advanced microscopy, dicing, taping and electronics capabilities.
It is expected to support companies developing technologies in quantum computing, photonics, communications and medical devices.
The Second Building is being delivered by Hansen Yuncken adjacent to the existing AMRF in Bradfield City.
Together, the first AMRF facility and the new building represent a A$300 million investment by the NSW Government in advanced manufacturing infrastructure.
The announcement coincides with planning approval for Burrah Park, a A$1 billion industrial estate within the Western Sydney Aerotropolis.
While the estate is expected to create more than 6,300 jobs across logistics and advanced manufacturing, the new semiconductor packaging facility is intended to strengthen Australia's domestic capability in semiconductor assembly and advanced manufacturing technologies.
NSW Minister for Planning and Public Spaces Paul Scully said the investment would help attract advanced industries to Western Sydney and create opportunities for businesses to expand their manufacturing capabilities in the region.
