Entegris targets AI chip thermal management
Entegris expands into silicon carbide and diamond-based materials to address thermal challenges in advanced semiconductor packaging.
Entegris has announced its expansion into silicon carbide (SiC) and diamond-enabled thermal management materials for next-generation AI advanced packaging, supported by a strategic acquisition and a new development partnership.
The company has completed its acquisition of Advanced Abrasives Corporation, a New Jersey-based manufacturer of diamond-based precision super-abrasive consumables used in hard-substrate polishing processes.
The acquisition strengthens Entegris' existing SiC chemical mechanical planarisation (CMP) capabilities, including slurries, pads, cleaning and surface conditioning technologies.
Following the acquisition, Entegris plans to establish a new manufacturing line in Taiwan to support the commercialisation of its SiC solutions, while continuing research and development in the US on next-generation thermal interface materials.
Entegris has also entered into a long-term development partnership with Element Six, a synthetic diamond specialist and part of De Beers Group, to accelerate the integration of diamond-enabled thermal management solutions into advanced semiconductor packaging.
The collaboration will focus on scalable wafer-level and heterogeneous integration approaches designed to reduce manufacturing complexity and thermal boundary resistance, supporting next-generation logic and memory devices and their 3D integration.
"Growth in AI compute, from model training to inference, is intensifying power and heat-management demands in data centers," said Olivier Blachier, President, Materials Solution and SVP, Chief Innovation Officer at Entegris.
The company believes that conventional heat-spreading materials will increasingly give way to engineered thermal interfaces and advanced materials as semiconductor packages become more complex and power-intensive.
"Our goal is to facilitate better heat dissipation without compromising performance or reliability. We're helping customers make that transition through materials innovation and integration at scale," Blachier added.
Entegris is expected to outline its advanced thermal management platform strategy at its Capital Markets Day in New York on 9 November 2026.
The developments reflect growing industry efforts to address heat dissipation challenges in AI accelerators, high-performance computing devices and densely integrated semiconductor packages.
