Teradyne enhances Titan HP testing
New system targets reliability testing for high-power AI accelerators and other advanced semiconductor devices.
Teradyne has introduced enhanced burn-in capabilities for its Titan HP platform, enabling manufacturers to combine reliability stress testing with system-level testing for high-power AI, automotive and other high-reliability semiconductor devices.
Traditional burn-in processes use dedicated ovens to expose devices to controlled temperatures for extended periods before functional testing.
Teradyne’s approach instead maintains each device at its target junction temperature while running a representative workload, with individual thermal control and power delivery tailored to each device.
The platform is designed to reduce test costs, factory floor-space requirements and time to market by consolidating reliability and system-level testing on a single system.
Its asynchronous slot architecture allows devices to be loaded and tested independently, preventing long stress runs on individual devices from holding up the rest of the system.
Test programs run on Teradyne’s Atlas software platform, which supports the import of existing programs and their portability across other Teradyne system-level test systems.
The company also plans to extend its per-device power capabilities to meet the requirements of future AI accelerators.
The introduction reflects growing demand for reliability testing as AI accelerators and cloud infrastructure devices face increasingly stringent reliability requirements.
Teradyne said the platform addresses pressure on capital investment, floor space and handling capacity at high-volume manufacturing and outsourced semiconductor assembly and test (OSAT) facilities.
The Titan HP platform with enhanced burn-in capabilities is available and deployed in production.
