VON ARDENNE targets panel-level packaging
The company is adapting HiPIMS deposition technology for glass vias and redistribution layers in advanced semiconductor packaging.
VON ARDENNE is expanding its semiconductor deposition portfolio into panel-level packaging (PLP), combining high-power impulse magnetron sputtering (HiPIMS) with its HISS horizontal coating platform.
The solution deposits dense, highly adherent barrier and seed layers in through-glass vias (TGVs), supporting advanced packaging applications that require precise film performance and uniformity.
By adapting established 300 mm wafer-level processes for larger panels, the company aims to help manufacturers scale production of TGVs and redistribution layers (RDL).
According to VON ARDENNE, improved film density and adhesion can reduce rework, enhance yield and potentially eliminate downstream process steps.
The technology targets growing demand for panel-level packaging in artificial intelligence (AI) and high-performance computing (HPC), where larger package formats and increasingly complex interconnects are driving manufacturing innovation.
According to Yole Group, the panel-level packaging market generated more than $300 million in revenue in 2025 and is projected to grow at a compound annual growth rate of more than 40% over the following five years.
