ACM ships panel-level plating tool
The 310 × 310 mm Ultra ECP ap-p production system targets high-volume panel-level advanced packaging, including copper pillar applications.
ACM Research has shipped its first 310 × 310 mm Ultra ECP ap-p panel-level horizontal electroplating production system to a customer in Asia outside mainland China.
The system is designed for panel-level advanced packaging and supports copper, nickel, tin-silver and gold plating processes.
ACM said the shipment represents a move into production-scale panel processing, following delivery of its first 515 × 510 mm R&D tool last year.
The Ultra ECP ap-p uses ACM's proprietary horizontal electroplating technology, with its copper plating chamber incorporating a high-speed paddle designed for tall copper pillar applications.
According to the company, it can provide within-die uniformity for 300-micron copper pillars at high plating rates.
Other features include a four-sided sealing dry-contact chuck, in-cell rinsing to reduce chemical cross-contamination and technology that synchronises chuck rotation with a rotating rectangular electric field to improve deposition uniformity.
ACM President and CEO David Wang said the shipment was an important milestone for the company's advanced packaging business, as AI drives demand for increasingly complex packaging architectures.
The company expects panel-level processing to gain traction as manufacturers seek to process larger substrates while improving manufacturing efficiency and yield.
