GF boosts advanced packaging investment
The company will redirect $955 million in CHIPS Act funding to accelerate advanced packaging and silicon photonics investments alongside plans for two new semiconductor fabs in New York.
GlobalFoundries (GF) has been selected to operate two new semiconductor manufacturing facilities in Malta, New York, under a US-Japan investment initiative providing up to $21 billion to expand domestic chip production.
The first 300mm fab is expected to begin operations in 2029, adding approximately 900,000 wafers of annual manufacturing capacity when fully operational. A second facility could provide a similar level of capacity.
Separately, GF has agreed with the US Department of Commerce to reallocate $955 million from its existing CHIPS and Science Act award to accelerate investments in advanced packaging, silicon photonics and silicon-germanium (SiGe) technologies at its facilities in Malta, New York, and Burlington, Vermont.
The investments aim to expand US manufacturing capacity for technologies supporting communications infrastructure and data centres, as demand for high-bandwidth connectivity and advanced semiconductor solutions increases.
The wider expansion is expected to generate approximately 27,000 construction and ecosystem jobs and more than 1,000 high-skilled manufacturing jobs in New York's Capital Region. The first fab is expected to break ground later in 2026.
