Evatec delivers first 310mm packaging tool
CLUSTERLINE 310 combines degas, etch and PVD processes for advanced packaging on small panel formats.
Evatec has delivered its first CLUSTERLINE 310 system for panel-level advanced packaging on 310 × 310 mm panels to a leading global integrated device manufacturer (IDM).
The system integrates degas, etch and physical vapour deposition (PVD) technologies to process glass and highly outgassing organic materials.
It is designed to support next-generation chip manufacturing, including fan-out panel-level packaging (FOPLP) and chip-on-panel-on-substrate (CoPoS) architectures.
The platform aims to deliver process uniformity and yield while reducing initial equipment investment, offering manufacturers flexibility as they scale panel-level packaging for high-performance computing and AI applications.
Evatec said the first delivery marks the start of a pipeline of global customer orders, with further deliveries scheduled in the coming months.
The company is extending its experience in larger panel processing to meet growing demand for 310mm solutions.
