Hummink unveils packaging repair module
The module uses high-precision capillary printing to repair micron-scale defects and help improve yields in advanced packaging manufacturing.
Hummink has unveiled its BIRD (Breakthrough Integration and Resolution in Defect Repair) module, designed to support micron-scale printing, defect repair and surface functionalisation in manufacturing processes.
The module uses the company’s High Precision Capillary Printing (HPCaP) technology to deposit materials at scales ranging from 0.6 to 50 µm.
It supports conductive, dielectric and functional inks with viscosities of up to 250,000 cP and is compatible with glass and a range of other substrates.
The technology targets yield challenges in advanced packaging, where defects in redistribution layers (RDLs) can lead to the scrapping of entire panels.
These challenges are becoming increasingly important as manufacturers adopt Fan-Out Panel-Level Packaging (FOPLP) and develop more complex architectures with finer RDL lines.
By enabling localised material deposition and defect repair, BIRD is intended to help manufacturers recover substrates that might otherwise be discarded, reducing material waste and improving production yields.
HPCaP technology has previously been demonstrated in research and development environments and is being deployed in pilot-phase display manufacturing lines.
Hummink says the BIRD module is now being tested at a major semiconductor and display manufacturer in Asia, marking its first deployment in an advanced manufacturing environment.
The company presented the module at SEMICON Europa 2026, held at Messe München from 10 to 13 November.
