Infinitesima targets advanced packaging
The UK metrology specialist marks its 25th anniversary with a new brand as it targets growing demand for angstrom-scale 3D process control in advanced packaging, hybrid bonding and HBM.
Infinitesima has marked its 25th anniversary with a new brand identity as it targets growing demand for high-speed, 3D process control in advanced semiconductor manufacturing.
Founded in 2001 by Professor Andrew Humphris, Infinitesima developed a faster approach to atomic force microscopy (AFM) that has evolved into technology for semiconductor production.
The company says the shift toward advanced packaging, chiplets, high-bandwidth memory (HBM) and increasingly complex 3D device architectures is increasing the need for production-speed, angstrom-scale metrology.
Infinitesima's Rapid Probe Microscope (RPM™) technology combines Hybrid Optical-AFM with optical techniques to provide high-speed 3D surface measurements.
The technology is integrated into its Metron3D™ platform, which is deployed in high-volume semiconductor manufacturing.
The company identifies hybrid bonding, advanced packaging and High NA EUV lithography as important opportunities for its 3D metrology technology.
It estimates that its addressable semiconductor metrology market could grow to more than US$6 billion over the next decade.
“As semiconductor structures become increasingly three-dimensional, conventional metrology techniques are struggling to keep pace, creating a growing measurement gap and increasing the need for angstrom-scale 3D process control,” said Peter Jenkins, President and CEO of Infinitesima.
The company is also expanding its applications and manufacturing presence in Korea and Taiwan, working with local partners to support semiconductor customers.
Infinitesima says its customers and collaborators include SK hynix, imec and ASML. The company's next phase will focus on providing the process-control capabilities needed as AI-driven demand accelerates the adoption of heterogeneous integration and advanced packaging.
