SEMICON Europa spotlights packaging
The Munich event will explore chiplets, hybrid bonding and next-generation packaging to strengthen Europe’s semiconductor industry.
SEMICON Europa 2026 will take place in Munich, Germany, from 10–13 November, bringing together semiconductor industry leaders to discuss advanced packaging, AI-driven manufacturing and Europe’s semiconductor strategy.
The Advanced Packaging Conference will focus on heterogeneous integration, chiplets and next-generation packaging technologies, including wafer- and panel-level packaging, hybrid bonding, silicon photonics, co-packaged optics and thermal management.
Sessions will also examine AI-powered inspection, advanced metrology and testing, alongside the challenges of moving packaging technologies from research into high-volume manufacturing.
The event’s Fab Management Forum, scheduled for 11 November, will address AI-driven factory automation, autonomous manufacturing and strategies to improve productivity, resilience and sustainability.
Additional sessions will cover semiconductor supply chains, 3D integration, energy-efficient AI hardware and European packaging pilot lines, highlighting opportunities to strengthen the region’s semiconductor manufacturing capabilities.
