Ace nanochem develops TGV slurry
The South Korean materials supplier has developed three semiconductor solutions, including a slurry designed to improve surface uniformity in glass through-via processing.
Ace nanochem has completed development of three semiconductor materials solutions, including a slurry for through-glass via (TGV) processing aimed at advanced semiconductor packaging.
The TGV slurry is designed to polish materials with different physical properties, including copper bulk, barrier metals and bare glass. The company says the formulation is intended to support the surface planarity and uniformity required for glass TGV manufacturing.
The development comes as glass substrates and TGV structures feature in advanced packaging approaches requiring precise surface processing. The slurry is one of three new materials announced by the South Korean company.
The other solutions include a polysilicon slurry for power trench MOSFETs, designed to achieve high removal rates while minimising gate oxide damage, and a silicon bare-wafer surface treatment solution intended to improve wettability and reduce particle contamination after chemical mechanical polishing (CMP).
Ace nanochem, which specialises in colloidal silica nanoparticle control technology, plans to expand its engagement with semiconductor manufacturers in Taiwan and Japan through technical collaboration and further business development.
