SEMI boosts advanced packaging collaboration
SEMI is expanding its Advanced Packaging and Heterogeneous Integration coalition to accelerate industry collaboration, standards development and next-generation semiconductor packaging technologies worldwide.
SEMI is strengthening its global focus on advanced packaging through its Advanced Packaging and Heterogeneous Integration (APHI) technology coalition, with dedicated summits planned across major semiconductor regions in 2027.
The initiative aims to accelerate manufacturing readiness, develop common standards and improve interoperability for technologies including chiplets, 2.5D and 3D integration, and photonic packaging.
Glass core substrates are also gaining attention, with potential industry adoption as early as 2028. Their dimensional stability and ability to support finer interconnects could help address warpage and scaling challenges in large semiconductor packages.
Meanwhile, silicon bridges and panel-level packaging are emerging as alternatives to conventional silicon interposers to improve interconnect density and manufacturing scalability.
Energy-efficient chip-to-chip interconnects remain a key priority, particularly for AI and data-centre applications, where reducing energy consumption per bit can lower power and cooling demands.
Through APHI, SEMI aims to strengthen collaboration across the semiconductor supply chain and support the development and adoption of advanced packaging technologies.
