ZEISS targets advanced packaging challenges
NLX enables non-destructive X-ray inspection, while DUNE measures and corrects wafer warpage.
ZEISS Semiconductor Manufacturing Technology (SMT) is highlighting two solutions for advanced packaging at SEMICON West 2026, addressing inspection and wafer warpage challenges in increasingly complex chip architectures.
ZEISS NLX uses non-destructive X-ray inspection to reveal internal structures in semiconductor packages, enabling manufacturers to inspect connections between stacked dies and identify potential defects. Designed for 300mm wafers, the system supports both process development and high-volume production.
ZEISS DUNE measures wafer topography and enables individual wafer warpage correction. The system is designed to support demanding manufacturing steps, including bonding, while helping prevent yield losses during downstream processing.
As chipmakers increasingly integrate multiple dies and chiplets into compact packages, reliable inspection and precise process control are becoming more important for manufacturing yield and productivity.
ZEISS SMT is also showcasing its photomask technologies at SEMICON West, including AIMS EUV 3.0 for photomask inspection and MeRiT for targeted defect repair. These solutions support lithography processes for advanced semiconductor manufacturing.
