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Thursday 12th February 2026
Marvell completes acquisition of XConn Technologies to expand PCIe and CXL switching portfolio
Thursday 12th February 2026
Texas Instruments to acquire Silicon Labs, expanding embedded wireless portfolio
Thursday 12th February 2026
Empower rolls out AI silicon capacitors
Thursday 12th February 2026
EV Group showcases hybrid bonding and maskless lithography technologies at SEMICON Korea 2026
Thursday 12th February 2026
Northrop Grumman secures $25B ATSP5 contract to accelerate trusted microelectronics for U.S. defense
Tuesday 10th February 2026
ASMPT expands SMT analytics with AI-driven line balance and yield analysis
Friday 30th January 2026
Adeia expands executive leadership team
Thursday 29th January 2026
Asahi Kasei develops the high-performance PFAS-Free PA66
Wednesday 28th January 2026
MKS announces pricing of private offering of €1 billion of 4.25% senior notes
Tuesday 27th January 2026
Surf-Tech Manufacturing adds ViTrox V510i AOI to strengthen advanced packaging inspection
Monday 26th January 2026
Canon's sustainability efforts recognised with top 1% platinum rating from EcoVadis
Friday 23rd January 2026
imec and Brewer Science to showcase flash-lamp debonding advances
Tuesday 20th January 2026
Amkor Technology reports strong 2025 results, driven by advanced packaging growth
Thursday 15th January 2026
AIM photonics enables space-qualified photonics research aboard the ISS
Wednesday 14th January 2026
Akrometrix announces their new Studio 10.1 update
Monday 22nd December 2025
AT&S appoints Gerrit Steen as new CFO and streamlines its Executive Board
Thursday 18th December 2025
DELO presents integrated edge blackening system to enhance AR optical performance
Tuesday 16th December 2025
AOI Electronics to support the establishment of semiconductor back-end processing business
Monday 8th December 2025
Banner Industries signs partnership agreement with Entrepix
Friday 28th November 2025
3D-Micromac AG expands market reach in China and Southeast Asia
Tuesday 4th November 2025
ASE Unveils an AI-Enhanced Platform IDE 2.0 for package design
Tuesday 7th October 2025
ClassOne expands solstice portfolio for advanced packaging metallization
Friday 30th May 2025
Marvell delivers advanced packaging platform for custom AI accelerators
Monday 26th May 2025
Deca signs advanced packaging agreement with IBM
