JCET boosts advanced packaging investment
JCET Group has raised its 2026 capital expenditure budget to RMB 17.31 billion as it expands advanced packaging capacity.
JCET Group has reported record revenue for the first nine months of 2026, alongside higher profitability, as growing demand for AI computing and high-performance computing drives investment in advanced semiconductor packaging.
The integrated circuit manufacturing and technology services provider recorded revenue of RMB 30.95 billion for the first three quarters, up 8% year on year.
Net profit attributable to shareholders increased 69.6% to RMB 1.62 billion, while third-quarter revenue reached RMB 11.43 billion, a year-on-year increase of 13.5%.
To support its growth strategy, JCET’s board has approved an increase in the company’s 2026 capital expenditure budget from RMB 9.98 billion to RMB 17.31 billion.
The investment will support advanced packaging technology development and manufacturing capacity expansion.
JCET is expanding high-end advanced packaging production at its Jiangyin facility, while a new high-end advanced packaging project in Shanghai continues to progress.
The company is aligning its technology roadmap with demand for high-density heterogeneous integration, low-power interconnects and efficient power delivery in AI and HPC applications.
Its computing electronics business, which serves markets including AI data centres, memory, interconnects and power solutions, grew 54% year on year during the first nine months and accounted for 30.9% of total revenue.
JCET is also advancing glass substrate and panel-level packaging technologies in collaboration with multiple customers, with related programmes progressing to pilot-line construction.
In co-packaged optics (CPO), the company has established heterogeneous integration capabilities for photonic integrated circuits (PICs) and electronic integrated circuits through its XDFOI® advanced packaging platform.
It has also developed the capability to co-package optical engines with switching and computing chips, targeting the interconnect requirements of next-generation AI infrastructure.
Beyond China, JCET is introducing high-end advanced packaging programmes at its South Korean manufacturing site and shifting its Singapore operations towards higher-value applications, including data centres.
The company said its global manufacturing network across China, South Korea and Singapore would support cross-site collaboration, research and development, high-volume manufacturing and supply chain coordination as it expands its advanced packaging business.
