GF to establish US silicon interposer supply
GlobalFoundries and TSMC have signed a multi-year $2 billion agreement to establish a US-based supply of silicon interposers for advanced AI packaging.
GlobalFoundries (GF) will provide manufacturing services to TSMC and expand fabrication capacity at its Malta, New York facility to support TSMC’s CoWoS advanced packaging ecosystem.
The agreement will establish what GF describes as the first US-based source of silicon interposers for advanced packaging applications, including components with embedded deep-trench capacitors.
The additional capacity is intended to provide greater flexibility and scale across multiple generations of advanced packaging technologies.
GF expects volume production at its Malta facility to begin ramping in the first half of 2028.
The initial agreement has a five-year term and provides a framework for further capacity expansion as demand for AI and high-performance computing systems grows.
The partnership comes as advanced packaging becomes increasingly important for integrating high-performance processors and memory while meeting the performance and power-efficiency requirements of AI systems.
Silicon interposers are a key element of 2.5D packaging approaches such as CoWoS, enabling high-density connections between logic and memory devices.
GF said the expanded US manufacturing footprint will also contribute to greater supply-chain resilience for advanced packaging.
