Visitech targets 1 µm advanced packaging
The LLS1000 targets high-throughput maskless imaging for FOWLP, FOPLP and co-packaged optics.
Visitech has launched its LLS1000, a 1 µm line/space photohead designed for maskless direct imaging in advanced packaging applications.
The new photohead is intended to enable toolmakers to develop customised imaging systems for large-substrate packaging, with Visitech targeting more than 50 panels per hour for 515 × 510 mm panels and more than 100 wafers per hour.
The LLS1000 incorporates real-time positional and panel-warp compensation and stitch-free exposure technologies.
These capabilities are designed to support fan-out wafer-level packaging (FOWLP), fan-out panel-level packaging (FOPLP) and co-packaged optics (CPO), while accommodating dies larger than a conventional reticle field.
Visitech says the technology is aimed at combining the flexibility of direct imaging with production-level throughput, helping manufacturers address yield, process flexibility and cost requirements as advanced packaging formats scale.
