Advanced packaging and chiplet summit returns to Tokyo in 2026
The Advanced Packaging and Chiplet Summit (APCS) is set for December 9–11, 2026, at Tokyo Big Sight, bringing together semiconductor packaging experts, technology providers, and industry leaders to explore the latest trends, innovations, and solutions in advanced packaging and chiplet integration.
Launched in 2022, APCS has quickly established itself as a key platform for the semiconductor packaging community.
The 2026 edition will feature a conference program focused on the latest industry developments, an exhibition area showcasing cutting-edge technologies, and opportunities for networking with leading figures in the field.
Educational sessions will cover topics ranging from packaging fundamentals to the newest advancements in die-to-die interfaces, 3D integration, heterogeneous chiplets, and high-density interconnects.
With the semiconductor market increasingly focused on miniaturisation, power efficiency, and reliability, APCS provides participants with practical insights to address these challenges and accelerate innovation.
The summit aims to strengthen Japan’s chiplet and advanced packaging ecosystem, offering attendees actionable knowledge, exposure to emerging technologies, and opportunities to collaborate on next-generation semiconductor solutions.
