In this interview, Tyler J. Myers, Technical Sales Engineer at Forge Nano, Inc., discusses Forge Nano’s role in the semiconductor and advanced packaging space. He explains how the company is addressing key challenges in advanced packaging, including material performance and process scalability, and how demand is evolving with the growth of AI and high-performance computing. Myers highlights recent innovations from Forge Nano that are enabling next-generation packaging solutions and shares his perspective on how the industry is expected to evolve in the coming years. He also outlines what he is most looking forward to discussing at Advanced Packaging International and why these insights are valuable for the broader semiconductor ecosystem.