Tata–ASML deal expands India’s chip push
India’s semiconductor ambitions move closer to full-scale manufacturing as Tata Electronics partners with ASML to support its upcoming 300mm fab and future production capabilities.
Tata Electronics has signed a strategic partnership with ASML to support development of its upcoming 300mm semiconductor fabrication facility in Dholera, India, marking a significant step in the country’s efforts to build a domestic chip manufacturing ecosystem.
The memorandum of understanding covers collaboration on lithography systems and related technologies for the planned $11 billion fab, which is expected to produce chips for automotive, mobile and AI applications.
ASML’s lithography tools are central to global semiconductor manufacturing, and the agreement is seen as a foundational step in establishing scalable production capability in India beyond mature-node technologies.
Industry analysts say the partnership could help enable manufacturing progress beyond 28nm using immersion deep ultraviolet (DUV) lithography and multi-patterning approaches, providing India with a stronger entry point into global chip production.
Beyond wafer fabrication, the collaboration is also expected to support broader ecosystem development, including assembly, testing and advanced packaging activities, as semiconductor supply chains increasingly shift toward chiplet-based architectures and heterogeneous integration.
The deal reflects wider global efforts to diversify semiconductor manufacturing capacity and strengthen regional supply chain resilience outside established hubs in Taiwan and China.
